为了减少锡膏与孔壁之间的摩擦力,便于脱模,进一步改善锡膏的释放效果,
在2004年初,宏光泰公司在传统减成工艺“电抛光”模板基础上,增加了特别的后
处理加成工艺——“镀镍”,并获得专利。镀镍模板结合了激光模板与电铸模板的
优点,让EMS(电子制造服务)企业有了更广泛的选择!
Ni. P. Stencil
To alleviate the friction force between hole walls and solder paste
and improve the volatile effects, in the year of 2004, H.G.T
adopted the special post manufacturing and forming method. This is known as Nickel
plating, a method based upon the traditional glitches electric
polishing method. This patent has been registered. (Please refer
to the Standard IPC7525, patent register number ZL03 2 20908.8)
The nickel plating stencil combines all the advantages of laser stencils
and electric casting stencils to provide additional options for electric
manufacturing services.
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